Intel decided to invest several billion Euro in ASML last month, a company makes and develops litographic tools, to ensure a continued development toward new manufacturing nodes. Also TSMC has invested in the company, but only acquires a minor share in the company compared to Intel.
ASML started an investment program to speed up the readying of tools for 450 millimeter wafers and EUV litography (Extreme Ultraviolet Litography). Part of the investment prorgram ASML would offer up to 25 percent of the company, and that investors would contribute additional funds to accelerate the development of larger wafers and EUV tools. Intel was first to acquire 15 percent for 2.55 billion Euro, and during a period of fives years it will invest another 830 million Euro to further speed up the development of the new tools.
TSMC has now joined Intel and acquired 5 percent of ASML for 838 million Euro (1.04 billion dollar). Like Intel, TSMC will invest additional funds during a period of fives yeas, but since its share is only 5 percent it will also be just a third of the sum – 276 million Euro (342 million dollar). There is still one share of 5 percent lef to be sold and the most likely buyers include Globalfoundries and Samsung
Even if this sounds like a lot of money the transition to 450 millimeter wafer is expected to cost the industry between 15 – 20 billion dollar. It is therefore a must for Intel and TSMC to make these investments to secure the transition to future nodes, where 450 millimeter wafers and EUV liteography will do lots to drive down the manufacturing costs in the very long run.
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